Product news

This new model supports 19 LTE bands (4G Cat 4), 7 WCDMA bands (3G HSPA+), 4 GSM bands (2G EGPRS) and includes an integrated GNSS receiver.

Full bonding lamination is a technology to enable the assembly of display and touch or display and cover to have better performance in terms of readability under intense light environment.

FPC-8100 is powered by Intel 10th generation processors with mPCIe for I/O expansion, 2 independant display output and wide range DC input (9-36V).

ADLINK offers three panel PC product families designed especially for embedded and industrial applications.

Salud 3030 mid-power LEDs are the first with datasheet specified melanopic ratios (MRs) in addition to 90+ CRI and R9 as high as 95.

The X6-240W series is 240W outdoor offline programmable LED driver that operates in constant current with high PF value and universal input voltage range 90~305Vac model.

Arch introduced their renewed AHCH05, 10 series (up to 10W); ARC60 (60W) and ANCH50 (50W) encapsulated PCB power supplies.

The MXM Series to meet the requirements of computer-on-modules for SMARC and Qseven specifications.

The embedded module TQMa8MxNL is based on the processor i.MX 8M Nano - an Arm®-Cortex®-A53 processor from NXP.

MultiTech Conduit® IP67 200 Series Base Station is a ruggedized IoT gateway solution, specifically designed for outdoor LoRa® public or private network deployments.

To be a part of IIoT field and advance your factory into a smart factory, machine vision is an essential section of automating production procedure.

MTX-IoT-S is an innovative and powerful all-in-one solution for the IoT sector. It features a very effective ULP (Ultra Low Power) system that allows the device to work with primary batteries for years.

NVE expanded their industry-leading family of magnetic switches with high-sensitivity versions of their ADT9xx-Series Tunneling Magneto Resistance (TMR) sensors.

The MPM-20SVLD is a family of compact 20W switching power supplies. All models meet high EMI standards with very few external components.

The PCIe-7396 is a 96-bit parallel digital input/output (DIO) expansion card with a PCI Express interface that makes it easy for users to install the PCIe-7396 on their systems quickly.

The new 5G NR module series is based on the newly-announced Qualcomm® Snapdragon™ X65 and X62 5G Modem-RF Systems.

Available in pluggable, screwless, and screw type configurations, CUI Devices’ terminal block connectors.

These high-end products are designed to bring enhanced computing and reliability to various vertical markets, such as Artificial Intelligence, Machine Learning, Internet of Things, and 5G Technology in Smart Retail, Smart Manufacture, Smart City, Healthcare and Medical Precision Diagnosis markets.