Product news

Embedded Cortex-A55 modules based on i.MX 93xx with Machine Learning Accelerator

Featuring discrete GPU @Intel® Arc™, MXM-AXe module with H/W ray tracing, AI acceleration, and 4x display, boasting precision graphics for time-sensitive edge applications required in healthcare, transportation, gaming, etc.

First RISC-V single-board computer (SBC) embraces open-source architecture

Vecow announced a ready-to-use software platform, the Vecow Hardware Monitor.

With the new DHCOR STM32MP13 DH electronics offers an entry-level Linux system with a large number of interfaces and application areas. For those who have so far equipped their systems with microcontrollers, the DHCOR STM32MP13 offers a real alternative.

i.Core MX93 is the new SOM based on the latest NXPs i.MX93 processor, equipped with Arm Cortex®-A55 @ up to 1.7 GHz processor with dedicated NPU. This energy-efficient SOM is developed on EDIMM 2.0 versatile pinout and is suitable for machine learning, IoT, industrial, and automotive devices. i.Core MX93 includes industrial features and temperature, a comprehensive set of peripherals, connectivity options such as 2x USB 2.0, and several display outputs.

ADLINK has been a pioneer in the development of the SMARC specification. SMARC is a business card size computer-on-module targeting ultra-low power applications.

Digi ConnectCore MP133 is a compact, wireless, and secure system-on-module based on the STMicroelectronics STM32MP133C MPU.

Laird Connectivity and Boundary Devices’ embedded system-on-module (SOM) development platforms deliver highly scalable embedded processing solutions with 802.11a/b/g/n/ac and Bluetooth wireless.

New Digi ConnectCore 93 Development Kit and system-on-module (SOM) variants.

While the modern world are pursuing new technologies every day, form factors like ETX, PC/104 and 3.5" SBC with legacy interfaces (For example, ISA) are rarely seen nowadays.

The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card.

The embedded module TQMa62xx, is based on the processor family AM62xx (Quad /Dual / Single Cortex A53) from Texas Instruments. This module is designed to use the pin-compatible processors on one module design.

With the new Intel performance hybrid technology, the module offers excellent performance values in multi-thread / multi-tasking applications.

New COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors.

SMARC, as a next-gen Computer-On-Module, has been well known for its compact size and low power consumption. Since SMARC 2.1, released in March 2020 by SGeT, it is equipped with 314 pins on a high-speed MXM3 connector, fully supporting the typical interfaces and signals on both x86 and Arm platforms, while fulfilling multimedia applications.

Availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly.

The SMARC 2.1 module TQMxE41S is available with a wide variety of processors in the power range 6 W to 15 W TDP.