Congatec introduces first COM-HPC Mini modules.

The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card. Together with the accompanying tailored cooling solutions, carrier boards and design-in services, Alcom now provides everything designers need for their next generation of high-end embedded and edge computing platforms. And with the new COM-HPC Mini standard, even the most space-constrained solutions can now benefit from a high-performance boost and a significantly larger number of new high-speed interfaces. Thus, entire product families can now migrate to the new PICMG standard – without requiring significant modification of the internal system design and housing.

Highlight of the innovations: COM-HPC Mini

The flagship are first samples of COM-HPC Mini designs with the new 13th Gen Intel Core processors (codename Raptor Lake), which represent the latest benchmark for the high end of embedded and edge computing at client level.
The COM-HPC Mini form factor predominantly addresses ultra-compact high-performance designs such as DIN rail PCs or rugged handhelds and tablets. However, COM-HPC Mini also solves the Gordian knot that developers of ultra-compact COM Express systems have been facing when wanting to switch to COM-HPC to be able to utilize latest interface technologies. The previously smallest COM-HPC footprint – COM-HPC Size A – did not allow this: Measuring 95x120 mm (11,400 mm²), it is almost 32% larger than the COM Express Compact form factor, which measures 95x95 mm (9,025 mm²). From a footprint standpoint, that’s 25 mm too wide to migrate existing COM Express designs to COM-HPC.