The new COM-HPC standard is now entering the home stretch for the ratification of version 1.0 of the specification, which is scheduled for the first half of 2020. Computer-on-Module manufacturers and carrier board designers who are active in the COM-HPC workgroup can now embark on first edge computing designs based on this pre-approved data.
The release of new COM-HPC modules, carrier boards and solution platforms can be expected in time with the next high-end embedded processor generations. They will extend the existing PICMG COM Express module standards with new solutions that move in the direction of headless edge server and more multifunctional edge client solutions.
With the adoption of the pinout, all committee members now have a solid working basis from which to offer interfaces supporting up to 100 GbE and PCIe Gen 4.0 and Gen 5.0 as well as up to eight DIMM sockets and high-speed processors with more than 200 watts on standardized COM-HPC modules, and to work on standard-compliant carrier board designs.