Computer & System-on-Modules

The feature set in detail. The new conga-HPC/cALP COM-HPC Client Size A modules (95x120mm), as well as the conga-TC670 COM Express Compact Type 6 modules (95x95mm) are available with 6 energy efficient 12th Gen Intel Core processors as well as a cost optimized Celeron processor. Both module families support up to 64 GB ultra-fast DDR5 SO-DIMM memory with 4,800 MT/s. Extraordinary graphics support for up to 4 independent displays and up to 8k resolution is provided by the integrated Intel Iris X graphics with the Intel Core i7 and i5 processors, and by the Intel UHD graphics with Intel Core i3 and Intel Celeron. To connect peripherals with massive bandwidth, the COM-HPC modules support up to 16 PCIe Gen 4 and 8 PCIe Gen 3 lanes, and additionally boast up to 2x Thunderbolt. The COM Express variants feature up to 8 PCIe Gen 4 and 8 PCIe Gen 3 lanes. Both support an optional and ultra-fast NVMe SSD. Further storage media can be connected via 2x SATA Gen 3. For networking, the COM-HPC e e ¬ module offers 2x 2.5 GbE, whereas the COM Express module executes 1x 2.5 GbE, with both supporting TSN. Sound is provided via SoundWire, HDO or I2S in the COM-HPC version, and HDA on the COM Express modules. Comprehensive board support packages are provided for all leading Real-Time Operating Systems, including hypervisor support from Real-Time Systems as well as Linux, Windows and Android.

Digi ConnectCore MP1 modules deliver a highly integrated and secure connected system-on-module solution.

Powerful dual or quad Cortex-A53 processor with Neural Processing Unit.

The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz.