Product news

COM Express R3.1 Compliant Modules — ADLINK Express-ADP Type 6 Basic size and Express-ID7 Type 7 Basic size Now Available

The WMX7205 module is a highly integrated wireless local area network (LAN) mini PCIe module, the module based-on Qualcomm FastConnect 6900 series WCN685x/QCA206x and that is supporting 802.11ax Wi-Fi and Bluetooth v5.x.

40W OVC III encapsulated power module, Regulated single and dual output, Isolation 4300VAC, 5000M Altitude application,Over-voltage category OVC III EN 61558 (New edition), Class II (Double Isolation) configuration with universal AC input voltage range, High efficiency up to 90%, No load power consumption <0.1W, Extreme low temperature cold start at -40°C, Highest up to +85°C,Safety approval to UL/IEC/EN62368-1, EN60335-1, EN61558-2-16

Ideal for industrial M2M and mobile computing solutions, the Sierra Wireless™ EM7590 Cat-13 embedded module delivers up to 400 Mbps downlink and 150 Mbps uplink high-speed connectivity.

The VaultIC408 1.x.x is a secure microcontroller-based solution designed to secure various systems against counterfeiting, cloning or identity theft. It is a hardware security module that can be used in many applications such as IP protection, access control, IoT or hardware protection.

Fibocom launched high-performance, dual-frequency GNSS positioning module G010

Our surface-mounted power inductors are designed for applications ranging from power supply to power converters.

Epson's S1C31 is the Arm^®Cortex^®-M0+ (32bit) processor family with several build in features based on Sound Processing, Image Processing Technology and Many years of Display Technology experience, provides unique products that are easy to use for customers.

The FT232RNQ is added to FTDI’s range of USB UART interface Integrated Circuit Devices. The FT245RNQ is a USB to parallel FIFO interface, with the new FTDIChip-ID™ security dongle feature.

The GSMA Mobile Economy Report released recently in Q1 has acclaimed that 2 billion 5G connections will be embraced globally by 2025 and the closure of 2/3G network is also estimated to be progressively done by then.

Secure NFC, Elements, Microcontrollers, Smart Card Readers

Epson’s CMOS Simple Packaged Crystal Oscillators (SPXO) contain a Quartz crystal and an oscillator integrated circuit.

Size: 3.5" x 2.5" x 1.06", I/P: 90~264VAC, O/P: 12, 24, 48 VDC, I/O Isolation: 4300VAC, Operating Temp: -40~ +85°C

Introducing the new ASLAN-W10 series widescreen panel PCs powered by Intel's 11th generation Tiger Lake processor

Silicon Labs’ xG24 kits are based on their EFR32™ Wireless Gecko System-on-Chip (SoC).

Fibocom SCA825-W is an AI smart module powered by the Qualcomm flagship IoT solution QCS8250, which integrates an octa-core high-performance Kryo™ 585 CPU, Adreno™ 650 GPU, Adreno 995 DPU, Adreno 665 VPU, NPU 230, Hexagon™ DSP, Spectra ™ 480 ISP.

ATP introduces its first NVMe M.2 2230 SSDs: the N700 and N600 Series built with 3D TLC.

Ultra-Compact Fanless Embedded Box PC, SPC-7000/7100, featuring the latest 11th Gen Intel Core i7/i5/i3 Processor with up to 28W TDP CPU.