Product news

The Vecow COM Express® product portfolio VCOM-1600 and VCOM-BASE are based on Intel Atom® x6000E processor, is designed in a compact size and provides power-efficient, with enhanced graphics performance and flexibility capabilities to power the Edge applications.

Congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

The world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors: COM-HPC Client Type and COM Express Type 6.

Soldered onboard Intel Apollo Lake SoC Processor, Intel I210IT PCIe GbE conntroller, Support Intel® Solid State Drive (SSD) Embedded "E SKU's, Single Channel 24-bit LVDS and 1 x DDI port

2th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules

SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC

ARBOR's embedded boards and solutions support wide temperature environment, suitable for industrial applications in harsh environments.

The TQMa117xL, based on the i.MX RT1170 CPU from NXP, scores with a compact size of only 31 mm x 31 mm and provides all CPU signals via a total of 277 LGA pads.

RSC-IMX8M is a 3.5-inch single-board computer that supports NXP® i.MX8M Quad ARM Cortex A53 Quad Core Up to 1.5GHz; Cortex-M4 core processor, providing an ultra-low power consumption with the TDP is less than 3.5W.

New 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

This next generation processor platform is the perfect upgrade for all NXP i.MX 6 based Qseven applications that have been running in the field for many years.

The module from the STM32MP1 family is now available as solderable DHCOR STM32MP1 version and as pluggable DHCOM STM32MP1 module.

The Digi ConnectCore 8M Mini is an embedded system on module (SOM) that supports rapid product development with complete open-source and scalable embedded software development tools, pre-certified wireless connectivity, cloud integration and built-in security.

Digi ConnectCore® 8M Mini, based on the NXP® i.MX 8M Mini application processor, is a secure integrated system-on-module (SOM) platform.

NXP i.MX 7 Dual Processor, Dual ARM® Cortex®-A7 Cores And Cortex-M4, 1GB DDR3L On-Board or optional 2GB, 8GB eMMC On-Board, 1 x RJ-45 port supports Gigabit LAN, 2 x 50pins connector for E INK display, 2 x USB 2.0 (Edge I/O), 4 x USB 2.0 (Internal), 1 x Micro USB for USB OTG, 1 x Micro SD card slot, 1 x M.2 E-Key Socket for WiFi/BT module expansion, 2 x 0.5W Speakers out connectors

Integrated AI accelerators and 28 GB DDR4 RAM enable graphics intensive workloads to ‘see’ a boost of up to 70% compared to predecessors.

TQ offers the first MIPI-CSI camera solutions.

Taoglas’ award-winning technology stack of hardware, firmware, device management and cloud analytics can cut time-to-market by up to 80% for any IoT application