Product news

Based on NVIDIA® Jetson Orin™ NX module, Vecow EAC-6000 series delivers up to 100 TOPS of AI performance and is designed to help accelerate the adoption of AI Edge applications for Medical Imaging, High-speed AOI, Mobile Robots and any AIoT/Industry 4.0 applications.

Learn about MPS FPGA Reference Designs

To enhance performance for various latest application demands, ADLINK announced the launch of edge computer platforms and embedded boards with 12/13th Gen Intel® Core™ processors, including ADLINK MVP series fanless embedded computers, ATX motherboards, and single board computers.

The latest SMARC modules leverage the TI Jacinto 7™ processor, bringing accelerated vision and AI processing alongside real-time control to your industrial and mobile machinery solutions.

This motherboard is designed for device expansion and high-speed data transmission, offering a wide range of CPU options and flexible expansion I/O interfaces.

GOWIN's latest GW5A(T) Arora-V family of high performance, low power 22nm FPGA, supporting up to 8x high speed transceivers, hardcore PCIe, hardcore A25 RISC-V, available in a wide range of package options including FPG676, PG484, UG324 with 138K LUTs, and UG324, MG121, UG256, PG256 & MG196 with 25K LUTs.

The NuMicro® MA35D1 series of microprocessors offers high performance, real time control, and advanced security features, making it an ideal solution for various applications such as smart factories, smart buildings, new energy, and Tiny AI/ML.

With ATX 3.0-compliant, FSP400-50AMB (PSU<450W & w/o 12V HPWR Connector) could handle up to 150% high power spike (Power Excursion) of the PSU’s rated power for 100μs; allow for faster response and system’s wake up by changing in the speed of the Power On signal and supporting Modern Standby.

Vecow Computer Vision Solutions for rolling stock and railway networks

Powerful Box PC FPC-9108 enables to share the workloads at the edge. It comes with Intel's 10th Gen processor and one PCI-E 16x expansion slot. It is designed for 350W GPU graphic card to enhance edge computing and AI inferencing applications.

Powered by the latest NVIDIA Jetson AGX Orin platform, featuring advanced NVIDIA Ampere architecture with up to 275 TOPS of AI performance

Designed to make Proof of Concept (PoC) easier, the ADLINK AI Camera Dev Kit integrates the NVIDIA® Jetson Nano™ SOC, an 8MP color MIPI camera module and validated software drivers to save effort on integration and solve compatibility issues.

Arora-V 22nm High-Performance FPGA family Arora-V high performance FPGA family utilizing advanced 22nm SRAM technology and integrating 270Mbps12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps.

To ensure that your PCIe M.2 SSDs operate at high speeds over sustained periods of time and to prevent overheating in embedded systems, Transcend offers customizable thermal control solutions

ADLINK’s new DLAP-400 and DLAP-200 series Edge AI Platforms based on NVIDIA^® Jetson^™ Orin technology will be set to provide enhanced deep-learning acceleration with a wide variety of industrial I/O ports and visual inferencing capabilities, all packed in a durable, fanless, and energy-efficient design, while supporting extended operating temperatures.

New COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors.

Avalue released the semi-rugged NUC-TGU and fast-to-implement ACS10-TGU box PCs. Both PCs are powered by Intel® 11th-Gen Tiger Lake UP3,

The SMARC 2.1 module TQMxE41S is available with a wide variety of processors in the power range 6 W to 15 W TDP.