Product news

The Digi ConnectCore® MP1 system-on-module (SOM) platform offers a comprehensive IoT development solution

Macro, Mini and Micro Programmable Gateways and End Nodes for the Internet of Things

The EFR32MG24A021F1024IM40 is an ideal solution for mesh IoT wireless connectivity for smart home, lighting and medical devices.

Laird Connectivity is setting to release the Tungsten700 SMARC System-On-Module (SoM) operating with a MediaTek Genio 700 processor and Laird Connectivity's imminent Sona MT320 Wi-Fi 6/Bluetooth 5.3 module.

Silicon Labs’ EFR32xG27 (xG27) family of wireless SoCs is now available to purchase, and its feature set is ideally suited to bring new functionality and design possibilities to industrial applications.

Based on Silicon Labs EFR32BG24 SoC, the Lyra 24 Series delivers on the silicon’s key features including a powerful Cortex-M33 with 1,536 kB Flash and 256 k RAM, Bluetooth 5.3 connectivity, Secure Vault High, AI/ML hardware accelerator, high sensing ADCs and an extended industrial temperature rating.

Digi’s suite of embedded solutions are designed to simplify and accelerate the development, deployment and management of secure, connected devices that can be managed and updated throughout their lifecycle.

Works With 2023 is bringing you two days of technical sessions, keynotes, and expert-led panels covering the latest trends, tools, and design techniques for developers. This free, all-virtual event features more than 40 technical sessions

New dual-band FG28 SoC, designed for long-range networks and protocols like Amazon Sidewalk, Wi-SUN, and other proprietary protocols.

5G Broadband, LPWA & LTE Module Update

Following Emwicon Modules will soon be available

For a prolonged period, RFID technology has been the cornerstone of location-tracking applications, owing to its RF-based communication capabilities.

Laird Connectivity, a global leader in wireless technology, today announces the BL5340PA (Power Amplified) Bluetooth module series, their most advanced, secure, and highest performing dual core MCU architecture wireless solution available.

The 5G Sub-6GHz and mmWave module Fx190/Fx180series are based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AIinnovations in architecture design, significantly improves 5G cellular capabilities and spectrum utilization.

The Digi XBee XR family operates in the 863-870 MHz range, delivering superior performance and interference immunity at 868 MHz

Which one is right for your cellular IoT deployment?

Two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).

The Digi XBee® 3 Global Cellular module is a compact, programmable, reliable solution with BLE and end-device carrier certifications for developing secure wireless devices with worldwide connectivity and global positioning.