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The 5G Sub-6GHz and mmWave module Fx190/Fx180series are based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AIinnovations in architecture design, significantly improves 5G cellular capabilities and spectrum utilization.
Equipped with Qualcomm®5G AI Processor Gen 2, Snapdragon X75 is the world’s first modem-RF system with a dedicated AI tensor accelerator. With 2.5X improved AI performance over Gen1, allowing modules to significantly improve the 5G cellular capabilities withultra-fast speed performance, extended network coverage, and spectrumutilization. Powered by Snapdragon X75 and X72, and a quad-core A55 CPU, FibocomFx190(W)/Fx180(W) series provide superior 5G experience especially for FWAapplications, offering optimized power consumption and multiple Wi-Fi 7 selections.
Compliant with3GPP Release 17 standard, Fibocom FG190(W)/FM190(W) module series are adoptingLGA and M.2 form factors into module design, efficiently driving theflexibility and scalability in a various of IoT terminal devices. By leveragingthe spectrum resources for a broader reach of faster speeds, the module series supportSub-6 GHz and mmWave dual-connectivity, as well as NR 10CA with up to 1000MHz bandwidth in the mmWave frequency band, significantlyboosting the maximum downlink speed of up to 10Gbps.
Flexible combinations for FWA application scenarios:
Fibocom is a leading global provider of IoT (Internet of Things) wireless solutions and wireless communication modules offering reliable, accessible, secure, and intelligent wireless solutions to every IoT application scenario for the increasingly digitalized industries and enriched smart life of the whole society.