Product news

MPS’s power modules have a wide VIN and IOUT range with a variety of packages.

The CA-IS209x and the CA-IS309x family of devices is galvanically-isolated RS-485/RS-422 transceivers with built-in isolated DC-DC converter, that eliminates the need for a separate isolated power supply in space constrained isolated designs.

ATTEND has been dedicated to providing high-quality, highly reliable connector solutions for industrial applications.

First Arm® Cortex®-M7 core microcontroller (MCU) product family, the GD32H737/757/759 ultra-high performance MCU series.

Engineered for 1U Edge servers, ATP's E1.S SSDs are designed for vertical placement in small-footprint systems, allowing up to 6 to 12 drives in a 1U chassis.

Designed for high-performance, low power, cost sensitive applications, the Arora-V family delivers 12.5Gbps SerDes, Hardcore PCIe, Advanced PLLs, Hardened DSP, Hardcore MIPI DPHY & CPHY, On-Chip ADCs,...

Adlink extended its portfolio of GPU modules with the introduction of the A380E graphics card – the company’s first graphics card in low profile PCIe form factor employing an Intel Arc A380E GPU. Aimed primarily at the commercial gaming market (slot machines, video lottery terminals and electronic games etc.), it can be integrated into ADLINK gaming platforms, such as the ADi-SA6X, which leverage Intel Core processors for great platform performance.

The S650Si (TLC) and S750Pi (pSLC) Series SD and microSD memory cards built with 176-layer 3D NAND technology and low-density parity check (LDPC) controller.

At just over 1cm in size, Intelligent Memory's PCIe & SATA BGA SSDs still pack a punch in features; such as a small footprint, enhanced shock and vibration resistance, and efficient heat dissipation, just to name a few.

Explore high-performance embedded building blocks that drive efficiency, performance, and adaptability from COM to cloud, revolutionizing embedded computing designs.

MPS Power Modules offer superior performance and size advantages when compared to other industry leading solution.

Alcom is ready to fill the void left by AMD/Xilinx's end-of-life announcement for Spartan II, Spartan 3, XC9500XL, CoolRunner XPLA 3, and CoolRunner II devices. By offering a suitable Coolgne Chip replacement-made in Europe!

These components are key in driving the boundaries of data transmission and processing capabilities forward. This overview delves into the transformative impact of M.2 sockets, DDR5 sockets, and MXM2/3.0 connectors.

μMiC is a series of Chipanalog micro-module in chip products.

The MECS-7120, from ADLINK Technology is a rugged and scalable edge computing solution designed to support the deployment of 5G RAN and private network infrastructure.

Explore MPS's breakthrough isolated power modules, spanning 200mW to 6W, featuring a fully integrated power converter in a single package, unveiling the world's smallest isolated power module, delivering 1W in a compact 4mm x 5mm LGA package.

Gowin devices offer replacement options for these Xilinx product families that are made End of Life.

We understand the challenges that arise when your favorite Xilinx devices are discontinued. In light of AMD's recent decision to phase out certain Xilinx CPLD chips, we're here to offer a seamless transition with our pin-to-pin compatible Gowin devices.