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OSM-IMX93
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
The OSM-IMX93 module supports LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and provides 15-year product availability.
Boasting the highest safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), the OSM-IMX93 is your ideal solution for various edge AI applications.
OSM-IMX8MP
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
The OSM-IMX8MP module supports HDMI, LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB 3.0 and USB 2.0 interfaces, MIPI-CSI and provides 15-year product availability.
Boasting the highest safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), the OSM-IMX8MP is your ideal solution for various IoT and edge AI applications.
Adlink's mission is to affect positive change in society and industry by connecting people, places and assets with artificial intelligence; we do this through the delivery of leading edge, robust and reliable hardware and software solutions that directly address mission-critical business and technology challenges.
