20/06/2025
Next-generation COM-HPC module, ESM-HRPL, along with the high-performance carrier board EEV-HC10. Designed for compute-intensive edge applications such as AI inference, smart healthcare, industrial automation, and intelligent energy systems, this solution delivers exceptional performance, modular scalability, and long-term product availability.
Compliant with PICMG® COM-HPC® Client Type specification, ESM-HRPL supports Intel® 12th/13th/14th Gen Core™ processors (LGA 1700, up to 65W TDP) and integrates the Intel® R680E chipset.