COM Express supports all modern interfaces

21/10/2022

COM.0 R3.1 Spec for COM Express to Include PCIe Gen 4 and USB 4.0 Support

COM.0 R3.1 adds support for PCIe Gen 4, for all module types, while adding USB4 support for Type 6 and updating 10G Ethernet to support CEI side-band signaling plus adding a second PCIe Clock for Type 7

R3.1 compliant, ADLINK provides two new modules, along with out-of-the-box ready development kits

Express-ADP Type 6 Basic size: powered by 12th Gen Intel^® Core^™ supporting advanced hybrid architecture with up to 6 Performance-cores (P-cores) and 8 Efficient-cores (E-cores) at 15W/28W/45W TDP

Express-ID7 Type 7 Basic size: powered by Intel^® Xeon^® D-1700 featuring integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance

Main Features

Express-ID7

AVX-512 VNNI for AI inference, data analysis
Up to 128GB DDR4 SO-DIMM, 2933MT/s, ECC
4x 10G Ethernet and NC-SI support
16 PCIe Gen4 lanes and 16 PCIe Gen3 lanes
10+ year product availibility
Extreme Rugged operating temperature: -40°C to 85°C (build option, selected SKUs)

Express-ADP

Performance hybrid architecture (P-core, E-core)
Up to 14 cores, 20 threads at 15W/28W/45W TDP
Up to 64GB DDR5 SO-DIMM at max. 4800MT/s, non-ECC
AI inference (AVX-512 VNNI, Iris Xe GPU 96EUs
4 displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4 (TBC)
1 PCIe x8 Gen4, 2 PCIe x4 Gen4, 2.5GbE (TSN opt.)
Extreme Rugged operating temperature (optional, selected SKUs)

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