Embedded Computing

Next-gen 3D NAND SSDs

Transcend has brought the next generation of BiCS4 96-layer SSDs for embedded and industrial applications featuring vertically stacked flash chips. This exciting technology ensures the durability of 3K P/E cycles, supporting intensive read/write applications. Capacity options up to 2TB satisfy companies’ storage requirements. The product lineup comes with different transfer interfaces, such as SATA III and PCIe, to meet varying needs for speed. Multiple form factors make these devices ideal for ultra-thin motherboards and space-constrained servers in industrial applications. The reliability is strongly enhanced as Transcend applies 30µ” gold fingers, extended temperature (-20°C to 75°C), corner bond, and dynamic thermal throttling technologies to the SSDs. Challenges ahead seem insurmountable, but Transcend is here for you to overcome them with solid and reliable storage solutions.

Key Features:

  • DRAM Cache embedded
  • 30µ” PCB gold finger*
  • Promised operational reliability in an extended temperature (-20°C to 75°C)
  • 3K P/E cycles (Program/Erase cycles) endurance rating
  • Key components fortified with default Corner Bond process
  • Dynamic thermal throttling

2.5″ SSD
Product Sheet
M.2 SSD 2280
Product Sheet
mSATA SSD
Product Sheet

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