Product news

Laird Connectivity and Boundary Devices’ embedded system-on-module (SOM) development platforms deliver highly scalable embedded processing solutions with 802.11a/b/g/n/ac and Bluetooth wireless.

New Digi ConnectCore 93 Development Kit and system-on-module (SOM) variants.

The latest HL Series LPWA module, the 5G HL7900, for next-generation use cases needing ultra-low power, increased device longevity and support for 3GPP’s latest 5G standards.

The MGM240P is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices for 2.4 GHz mesh networks.

Lower-cost, intelligent, easy to program radio sub-system; a high performance System-on-Chip RF transceiver. Variants include Point-to-Point, Point-to-Multi Point and LPWAN Sigfox / LoRa.

The FG25 is the ideal SoC (system on chip) for long-range, low-power transmissions, capable of broadcasting up to 3km with minimal data loss in dense, urban canyon environments when coupled with the Silicon Labs EFF01 Front End Module.

The proliferation of smart home devices can be a drag on network efficiency.

Sierra Wireless is now officially part of Semtech

New Summit SOM 8M Plus is powered by NXP’s innovative i.MX 8M Plus processor and 88W8997 wireless silicon coupled with onboard NXP PMICs (PCA9450CHN and PM823UK), performance LPDDR4 RAM, and eMMC 5.1 storage.

LoRaWAN Gateways, LoRaWAN Sensors, LoRaWAN Endpoints

Sierra Wireless ‘ EM and MC Series standards-based connectorized modules in Mini Card and M.2 form factors providing connectivity to the world’s fastest 5G and 4G networks.

Join Silicon Labs experts and other industry leaders for these technical webinar series' created for developers, by developers.

Holtek announces its new Sub-1GHz OOK RF Receiver Flash MCUs, the BC66F2332-1 and BC66F2342-1.

The Lyra Series includes small form factor PCB modules, as well as ultra-compact SIP options, to suit any host board footprint.

The Digi ConnectCore® MP157 Development Kit features a tightly integrated, secure and industrial-specified connected system-on-module (SOM) solution in a small and reliable form factor.

Global investment into wide-scale network connectivity has been growing in recent years, from smart cities and factories to last mile service provision in hard-to-reach locations.

Dual Band Realtek RTL8852BE IC based solution & Triple Band Qualcomm WCN6856-5 / QCA2066-5 IC based solution

Digi XBee RR wireless modules accelerate time-to-market for designers, OEMs and solution providers by quickly enabling wireless connectivity and easy-to-add functionality.