Product news

Laird Connectivity is setting to release the Tungsten700 SMARC System-On-Module (SoM) operating with a MediaTek Genio 700 processor and Laird Connectivity's imminent Sona MT320 Wi-Fi 6/Bluetooth 5.3 module.

Adlink is delighted to introduce the MXM-AXe GPU module, a groundbreaking innovation that revolutionizes embedded graphics processing.

EmETXe-i92U0 is specifically built to withstand harsh environments, with a wide range power input of 8.5-20V and an operating temperature range of -40 to 85°C.

A new Engicam COMe module, based on Intel® TIGER LAKE processors with the new Intel® Iris® Xe graphics. The platform offers up to 2.95 times higher graphics performance. The module combines a high-performance CPU, single-thread performance of up to 23%, and multi-thread up to 19% faster than the previous generation processors.

Digi’s suite of embedded solutions are designed to simplify and accelerate the development, deployment and management of secure, connected devices that can be managed and updated throughout their lifecycle.

Get into the fast lane to IoT-connected industrial application development with our conga-SA7 Computer-on-Modules. These cutting-edge modules not only offer real-time operation but also provide seamless real-time connectivity and leverage advanced real-time hypervisor technologies. The SMARC 2.1 module is based on Intel® Atom® x6000E and Intel® Pentium® and Celeron® J Series processors.

Engicam presents the new MicroGEA STM32MP13 based on the latest ST® processor equipped with Arm® Cortex®-A7 up to 1GHz. The module offers energy-efficient performances and is designed to provide full capabilities both in high-end wearables, and other low-power embedded and consumer applications.Dual Ethernet network interfaces in a highly compact form factor (25x25 mm).

The latest SMARC modules leverage the TI Jacinto 7™ processor, bringing accelerated vision and AI processing alongside real-time control to your industrial and mobile machinery solutions.

In attachment you can download an article written by Christian Eder, Director of Marketing at Leading CoM module manufacturer Congatec, represented since its foundation by Alcom electronics.

Embedded Cortex-A55 modules based on i.MX 93xx with Machine Learning Accelerator

Featuring discrete GPU @Intel® Arc™, MXM-AXe module with H/W ray tracing, AI acceleration, and 4x display, boasting precision graphics for time-sensitive edge applications required in healthcare, transportation, gaming, etc.

First RISC-V single-board computer (SBC) embraces open-source architecture

Vecow announced a ready-to-use software platform, the Vecow Hardware Monitor.

With the new DHCOR STM32MP13 DH electronics offers an entry-level Linux system with a large number of interfaces and application areas. For those who have so far equipped their systems with microcontrollers, the DHCOR STM32MP13 offers a real alternative.

i.Core MX93 is the new SOM based on the latest NXPs i.MX93 processor, equipped with Arm Cortex®-A55 @ up to 1.7 GHz processor with dedicated NPU. This energy-efficient SOM is developed on EDIMM 2.0 versatile pinout and is suitable for machine learning, IoT, industrial, and automotive devices. i.Core MX93 includes industrial features and temperature, a comprehensive set of peripherals, connectivity options such as 2x USB 2.0, and several display outputs.

ADLINK has been a pioneer in the development of the SMARC specification. SMARC is a business card size computer-on-module targeting ultra-low power applications.

Digi ConnectCore MP133 is a compact, wireless, and secure system-on-module based on the STMicroelectronics STM32MP133C MPU.

Laird Connectivity and Boundary Devices’ embedded system-on-module (SOM) development platforms deliver highly scalable embedded processing solutions with 802.11a/b/g/n/ac and Bluetooth wireless.