Product news

A 96W ultra-slim DIN-rail power supply. Ideal for building automation, household and industrial control systems.

When it comes to selecting what goes into the custom hardware for embedded systems, developers have more choices than ever—and each has its own sweet spot.

The easyRadio eRIC-LoRa RF transceiver module is a complete sub-system that combines a high performance low power RF transceiver, a microcontroller and a voltage regulator.

Alcom offers an extensive range of DC/DC & AC/DC alternatives to Mornsun

If different electrical components are combined in an appliance inlet to form a power entry module, the individual power losses and temperature deratings of all components involved must be carefully taken into account in order to ensure long-term safe operation.

With support for a wide input voltage range of 4.5-V to 100-V, two optional operating modes, light load PSM (TPP00032), and FPWM (TPP00031), integrated overcurrent/overvoltage/overtemperature protection, and other product performance strengths

New I/O Voice OTP Microcontrollers (MCUs). One special feature of the devices are their internal 2/4/8Mbit Voice Flash Memory which can be repeatedly updated with up to 85/170/340 seconds of voice storage.

Selecting the Right Wireless Components for Matter Development

Explore "Custom Touch" Functions for our BT815 / BT817 / FT811 / FT813 and our new BT881 / BT883!

GigaDevice's customers can now use SEGGER's leading multi-platform IDE Embedded Studio free of charge across all GigaDevice RISC-V microcontrollers (MCUs) including the latest GD32VW553.

The GD32E235 series MCU, powered by the Arm® Cortex®-M23 core, operates at clock frequencies of up to 72MHz.

GigaDevice and SEGGER announce their collaboration to provide customers with SEGGER emWin embedded system graphics library, free of charge. GigaDevice customers can now use emWin , as well as AppWizard, across all GD32 Cortex®-M series MCUs.

The GD32VW553 series Combo Wireless MCU based on the RISC-V core supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity.

The new xG26 family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU.

In a versatile standard for small-size and low-cost soldered-down including the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) a complete and competitive product portfolio based on leading edge CPU cores suited for a variety of applications will be announced and available shortly(Q2’24).

The SiWx915 and SiWx917 feature Wi-Fi 6 and Bluetooth LE 5.4 along with integrated application processor.

Add Attrractive Touch-enabled HMIs with our Embedded Video Engines

The new HT7Q2552 provides an I²C interface to control system configuration and MCU communication as well as supporting short-current discharge protection, high-voltage wake-up and interrupt return for over-temperature chip protection.