Product news

Amtek’s FFC(Flexible Flat Cable) / FPC(Flexible Printed Circuit) connectors

Gowin introduced the GoBridge ASSP product line with the release of their GWU2X and GWU2U USB interface bridging devices.

NetPower EV on-board DC-DC converters are available with multiple input voltage ranges covering from 65V to 800V.

The InVehicle G710 is a new vehicle LTE gateway developed specially for the Internet of Vehicles (IoV).

Epson S1D15106 can provide the look of a large, fully digital cluster utilising its 368 segment drivers in combination with only a small colour TFT display.

MPS automotive-grade solutions are precision engineered to perform under the most demanding environments.

Multi-layered privileges, sanitization features offer high levels of storage security to safeguard data from authorized acces

Alcom electronics has experience and skills in high brightness and high contrast display modules offering multi-function display modules.

Angle Sensor with Integrated Wake-Up and Interrupt Logic, featuring the world's smallest ICEncoder^TM.

The FYUEB150x054 200 - 420V input battery charging DC-DC converter is a full brick converter rated for 810W at 15V/54A output and it is specially designed for battery charging and other applications that need a controlled current source.

Nine new series’ of automotive and commercial grade molded powder inductors. The PA540x, PA544x (commercial grade) and PM540x, PM544x (automotive grade)

Integrating Ryzen embedded V1807B APU and NVIDIA Tesla/Quadro/GeForce/AMD Radeon Graphics, Vecow MIG-1000 delivers suitable computing and graphics performance.

Pulse adds three new platform sizes to its composite core power inductor productgroup.

Full bonding lamination is a technology to enable the assembly of display and touch or display and cover to have better performance in terms of readability under intense light environment.

The new 5G NR module series is based on the newly-announced Qualcomm® Snapdragon™ X65 and X62 5G Modem-RF Systems.

Alcom markets a complete range of small, medium and large industrial TFT panels from 0.96" to 15.6" and round TFT's up to 5"

AMTEK offers various Board-to-Board connector which provides signal connections for microminiature, high-speed, high-denisty and high-power applications, such as stacking, mezzanine, coplanar, orthogonal and PCB connectors.

The ATP e.MMC integrates raw NAND flash memory and hardware controller integrated within a 153-ball fine pitch ball grid array (FBGA package).