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Next-gen 3D NAND SSDs

23/02/2021

Transcend has brought the next generation of BiCS4 96-layer SSDs for embedded and industrial applications featuring vertically stacked flash chips. This exciting technology ensures the durability of 3K P/E cycles, supporting intensive read/write applications. Capacity options up to 2TB satisfy companies’ storage requirements. The product lineup comes with different transfer interfaces, such as SATA III and PCIe, to meet varying needs for speed. Multiple form factors make these devices ideal for ultra-thin motherboards and space-constrained servers in industrial applications. The reliability is strongly enhanced as Transcend applies 30µ” gold fingers, extended temperature (-20°C to 75°C), corner bond, and dynamic thermal throttling technologies to the SSDs. Challenges ahead seem insurmountable, but Transcend is here for you to overcome them with solid and reliable storage solutions.

Documents Tech question
Transcend SSD452 K web

Next-gen 3D NAND SSDs

  • Features
  • Applications
  • Technologies
  • Manufacturer
  • Documents
  • DRAM Cache embedded
  • 30µ” PCB gold finger*
  • Promised operational reliability in an extended temperature (-20°C to 75°C)
  • 3K P/E cycles (Program/Erase cycles) endurance rating
  • Key components fortified with default Corner Bond process
  • Dynamic thermal throttling

Applications & Markets

  • 16 Kiosk POS Digital Signage

    Kiosk, POS & Digital Signage

  • 5 Industrial Automation

    Factory & Industrial Automation, Robotics

  • 7 Io T Industry 4 0

    IIoT & Industry 4.0

Technologies

  • Shutterstock 605229797

    Memory & storage

Transcend

Transcend memory for embedded solutions include SSD and Flash solutions, Memory Cards and DRAM Modules.

Read more
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Documents

  • Transcend Embedded PS MSA452 Tn I Product Data Sheet
  • Transcend Embedded PS MTS952 Tn I Product Data Sheet
  • Transcend Embedded PS SSD452 Kn I Product Datasheet
Pexels thisisengineering 3913017

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