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New xG26 family of Wireless SoCs and MCUs

12/04/2024

The new xG26 family consists of the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.

BG26: Our Newest High-Performance, Energy-Efficient Bluetooth LE SoC

The BG26 2.4 GHz wireless SoCs provide maximum flash and RAM, ensuring the longevity of your devices. With PSA Level 3 Secure Vault protection, BG26 offers a generous GPIO count and BGA packages.

MG26: Our Most Advanced SoC for Matter

The MG26 Multiprotocol Wireless SoCs are ideal for mesh IoT wireless connectivity using Matter, OpenThread, and Zigbee protocols for smart home, lighting, and building automation products.

PG26: Our Largest Memory Footprint MCU Yet

The PG26 32-bit MCU is ideal for enabling a wide range of low-power and high-performance embedded IoT applications.

Main Features

xG26 features:

  • 3MB Flash
  • 512kb RAM
  • AI/ML Accelerator
  • 20-bit ADC
  • Segment LCD controller
  • High Pin count pacakges: 6x6 QFN 48, 8x8 QFN 68, 7x7 BGA 136
Documents Tech question
Silicon Labs MG26 PG26 BG26

New xG26 family of Wireless SoCs and MCUs

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  • Silicon labs x G26 family of Wireless So Cs and MC Us
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