The new MXM 3.0 Connectors are designed for high-density applications requiring high-speed data transfer and uncompromising reliability.
With a small footprint and PCIe interface, these connectors unlock ultra-smooth graphics and rapid AI computing for gaming and automation. The modular design also allows seamless upgrading to next-gen components.
We pack industry-leading signal integrity, EMI shielding, and vibration resistance into an ultra-compact product. The connectors are customizable for unique use cases across industries.
The 125B-78C00 and 125A-78C00 connectors, with a 0.50 mm pitch, offer 314 contacts, optimizing the PCB space and supporting a myriad of high-speed peripheral applications. The 7.8 mm height of the connectors, along with a module board mating height of 5.0 mm from the main board, allows for compact system designs without sacrificing connectivity.