Main Features
HPM-ERSUA Highlight Features:
- Intel LGA4677 Socket supports 5th Generation Intel® Xeon® Scalable Processor (Max. TDP at 270W)
- Intel® C741 Chipset
- 6 x DDR5 5600 MHz RDIMM up to 1.5TB
- TPM 2.0 onboard
- IPMI 2.0 with AST 2600 BMC controller onboard
- 1 x Intel I210AT Giga-bit Ethernet
- 1 x Intel I226-LM 2.5Giga-bit Ethernet
- 1 x Intel X550-AT2 10Giga-bit Ethernet
- 5 x SATA III support RAID 0,1,5,10
- 1 x Internal RS232 port
- 4 x USB 3.2 Gen1 ports & 2 x USB 2.0 ports at Edge I/O
- 4 x Internal USB 3.2 Gen1 ports
- 1 x M.2 M-Key PCIe 3.0 x4 NVMe SSD, 2242/2260/2280/22110 form factor
- 12" x 9.6" (304.8mm x 243.84mm), PCB thickness is 2.54mm
HPM-ERSDE Highlight Features:
- Dual Intel LGA4677 Sockets support 5th Generation Intel® Xeon® Scalable Processor (Max. TDP at 270W each)
- Intel® C741 Chipset
- 12 x DDR5 5600 MHz RDIMM up to 3TB
- TPM 2.0 onboard
- IPMI 2.0 with AST 2600 BMC controller onboard
- 1 x Intel I210AT Giga-bit Ethernet
- 1 x Intel I226LM 2.5Giga-bit Ethernet
- 1 x Intel X550-AT2 10Giga-bit Ethernet
- 5 x SATA III support RAID 0,1,5,101 x Internal RS232 port
- 6 x USB 3.2 Gen1 ports at Edge I/O
- 2 x Internal USB 3.2 Gen1 ports & 2x USB 2.0 type A receptacle
- 1 x M.2 M-Key PCIe 5.0 x4 NVMe SSD,2242/2260/2280/22110 form factor
- 12” x 16.452” (304.8mm x 417.88mm), PCB thickness is 2.86mm
