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ATP’s managed NAND solutions integrate raw NAND flash memory and hardware controller. As soldered-down solutions, they are secure against constant vibrations, making them ideal for embedded and automotive applications requiring rugged endurance and durability.
e.MMC offerings use a 153-ball fine pitch ball grid array
(FBGA package). Smaller than a typical postage stamp, its tiny footprint makes the e.MMC perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments.
NVMe Heat Sink Ball Grid Array (HSBGA) SSDs are ATP’s tiniest NVMe flash storage solutions. They use high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane.
ATP Electronics is the leading provider of “Industrial Only" high-performance, high-quality and high-endurance NAND flash products and DRAM modules.
