e.MMC for Embedded, Industrial and Automotive markets – Extreme Endurance, Advanced Performance in a Tiny Package
The ATP e.MMC integrates raw NAND flash memory and hardware controller integrated within a 153-ball fine pitch ball grid array (FBGA package). Smaller than a typical postage stamp, its tiny footprint makes the e.MMC perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments. As a soldered-down solution, the ATP e.MMC is secure against constant vibrations, making it ideal for embedded and automotive applications requiring rugged endurance and durability. ATP e.MMC products with Automotive Grade (AG) 2 rating offer wide temperature support from 40 to +105°C while AG3-rated e.MMC supports industrial temperature ranging from -40°C to 85°C. ATP e.MMC complies with stringent qualifications and testing specific to the automotive industry, such as AEC-Q100 reliability specifications, Production Part Approval Process (PPAP) and Advanced Product Quality Planning (APQP).