- Ultra low power consumption
- User Flash
- Multiple I/O Standards
- Abundant Slices
- Block SRAM with multiple modes
- Flexible PLLs
- Built-in Flash programming
Today, mobile and wearable applications are pushing the limits on power usage, especially where the size of devices are causing batteries to get smaller. Yet end users are wanting better battery efficiency to reduce their charging time. GOWIN addresses these concerns with the GW1NZ “Mobile FPGA.” Based on it CoolSmart® technology and TSMC’s 55nm Ultra Low Power Embedded FLASH process, GOWIN delivers an ultra-low power, small size, and cost-effective FPGA solution targeted for these mobile and wearable applications.
Available in a 16-ball 1.8mm x 1.8 mm WLCSP package, the GW1NZ “Mobile FPGA” includes GOWIN’s CoolSmart® Technology, enabling a standby power below 10uW (ZV device). It will also feature MIPI I3C and MIPI SPMI master and slave hardcore IP for direct connection to other MIPI compliant devices. The first offering will be a 1K LUT device; more sizes and package options are forthcoming.
Device programming is accomplished with GOWIN’s proprietary toolchain. In addition, a complete library of IP cores and reference designs are available to assist in developing platform solutions.