| Insulator | Thermoplastic, rated UL94 V-0 |
| Contact Material | 0.635mm square pin, copper alloy |
| Contact Surface | Acc. to options (see below), over Ni (1.3 … 2.5µm) |
| Contact Resistance | < 20 mΩ |
| Insulation Resistance | > 1000 MΩ |
| Test Voltage | 500 V AC |
| Voltage Rating | 250 V AC |
| Current Rating | 3 A |
| Temperature Range | -40 °C … +125 °C |
| Processing | Reflow soldering |
Electronic Component Solutions
SMT-Mixed Technology Pin Headers
The series 9231 Type D connects all advantages of both Surface Mount (SMT) and Through Hole Reflow (THR) technologies.
This combination is beneficial, when it comes to stability in small spaces. Thanks to the through-hole-assembled contacts, the THR method ensures a reliable and vibration resistant connection. Surface-mounted SMT pins require little space, without additional drilling on the PCB. This saved area is available for conducting paths. THR-SMT mixed combinations are applied wherever the circuit board architecture needs reliable and at the same time space saving components. W+P provides mating parts and further mixed-technology-connectors.
