SuperFlash® technology is an innovative and versatile type of NOR Flash. SuperFlash technology uses a proprietary split-gate cell architecture which provides superior performance, data retention, and reliability over conventional stacked gate Flash.
Serial and parallel flash memory products are an excellent choice for applications requiring superior performance, excellent data retention and high reliability.
NOR Flash is available with either a serial or parallel bus interface. The choice of which bus to use is often dictated by the required data rates of the application as well as the amount of available I/O on the microcontroller and the board space available. With the ongoing demand for smaller and cheaper products, more designs are now being switched to a serial interface to reduce board space and component price.
Parallel Serial SPI
Data Throughput High Medium
Pin Count 32+ 8+
Package Size Large Small
Power Consumption Medium Low
Cost High Low
Today’s microcontrollers are often bond pad-limited. This means that the size of the die is limited by the space needed for bond pads rather than for the microcontroller gates / circuitry. Eliminating bond pads results in a smaller die, increasing the amount of die on a wafer and resulting in reduced cost per die. Additionally, more pins increase the assembly and packaging costs of both the microcontroller and the memory. This is why there has been a major shift from using parallel Flash to using serial Flash. However, switching to fewer pins means lower data throughput. In order to offset this, a quad I/O serial interface is being used in the latest serial devices to create SQI™ Flash devices.