High-speed, stable data connection
FIBOCOM HSPA/HSPA+ module is specially designed for the supplementing M2M technologyand mobile broadband. It is compact, has low power consumption, and has a fast and reliable data connection. The built-in TCP/IP protocol stack has been successfully applied to countless global terminals.
FIBOCOM HSPA/HSPA+ module meets industrial grade demands and can adapt to severe working environments with high temperature, high humidity,and electromagnetic interference. It has become the ideal platform in the fields of M2M technology application, such as multimedia, video monitoring,electric payment, remote medical service, tablet PC,and consumer electronics.
42.0 x 22.0 x 2.35 mm
3G M.2 module,supports GSM/GPRS/EDGE and UMTS/HSDPA/HSUPA/HSPA+.
29.8 x 17.8 x 2.0 mm
LGA module,supports GSM/GPRS/EDGE and UMTS/HSDPA/HSUPA/HSPA+.
33.8 x 27.8 x 2.45mm
Adopt one of the most advanced Intel platforms in the industry,support the main 3G frequencies of global 3G.
FIBOCOM H330S Mini PCIe
30.0 x 50.95 x 3.45 mm
Adopt one of the most advanced Intel? platforms in the industry,support the common frequencies of 3G.
|Fibocom H330S Mini PCIe